Publication: Characterization of nanocomposite sn/ag coating for bus duct conductor
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Date
2024-03-01
Authors
Kong, Chee Xian
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Abstract
With the advent of contemporary buildings and large-scale workshops that require a
lot of electricity, the busduct system has been chosen as the power distribution unit.
Tin-plated busbars have relatively low bulk resistivity, causing higher contact
resistance as high current passes by. The power loss is released as heat, increasing the
joint temperature and eventually reducing current-carrying capacity. Incorporation of
silver nanoparticles (AgNPs) in the Sn matrix could potentially improve the contact
resistance of busduct conductors. The coating morphology, phase structure, surface
roughness, and contact resistance of the Sn/AgNPs composite with magnetic stirring
electroplating (MSE) and ultrasonic-assisted electroplating (USE) were compared.
Also, the size and concentration of AgNPs in Sn/AgNPs via USE were studied as well.
Finally, plating parameters were optimised for lab scale, and prototype samples were
fabricated. The USE facilitated the co-deposition of AgNPs and formed a smooth and
compact silvery-grey coating compared to that of MSE. Sn (U) has a thicker coating
with less plating time than Sn (M). The average coating thickness was increased until
agglomeration of white clusters was observed: Sn/10Ag3 (U) for 10 nm AgNPs
addition and Sn/100Ag2 (U) for 100 nm AgNPs addition, respectively. Increasing the
concentration of AgNPs, the wt% of Ag increased up to 1.77 % and 1.59 % for both
types of AgNPs. The crystallise size was refined to 30.48 nm for Sn/10Ag2 (U) and
27.38 nm for Sn/100Ag2 (U). The refinement could be a combined effect of USE and
AgNPs addition. Sn/10Ag2 (U) has the lowest Ra value of 1.15 nm and lowest contact
resistance of 6 μΩ compared to Sn coating with 8.67 μΩ, i.e., 31 % reduction.