Publication: High-performance polyimide/nanoparticles composite as encapsulation material for electronic packaging
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Date
2025-09-01
Authors
Yang, Li
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Abstract
The rapid advancement in electronic devices demands innovative packaging solutions that can handle high power, miniaturization, and heat dissipation. Packaging materials, particularly polymer-based materials like polyimide (PI), are crucial for ensuring mechanical support, thermal management in microelectronic devices. The goal is to develop PI-based nanocomposites that reduce the coefficient of thermal expansion, improve thermal stability. SiO₂ and Al₂O₃ nanoparticles were surface-modified to improve dispersion and compatibility with the PI matrix. Structure analysis confirmed the successful integration of nanoparticles with the matrix, demonstrating effective surface modification of the nanoparticles and structural changes. Morphological and microstructural analyses revealed the degree of nanoparticle-matrix interaction and the uniform dispersion of nanoparticles in the nanocomposites. The optimal content of SiO₂ and Al₂O₃ nanoparticles was found to be 6 wt% and 4 wt%, respectively, which contributed to enhanced performance. Thermogravimetric analysis indicates that the decomposition temperatures of SiO₂ and Al₂O₃ nanoparticles reach their highest values of 474°C and 482°C, respectively, when their content is at 10 wt%, demonstrating an improvement in thermal stability. Thermomechanical analysis shows that the coefficients of thermal expansion (CTE) of SiO₂ and Al₂O₃ nanoparticles reach their lowest values of 0.288 × 10⁻⁶ /°C and 0.192 × 10⁻⁶ /°C, respectively, at 10 wt%. Finally, surface roughness analysis reveals that as the nanoparticle content increases, the surface roughness also increases. The PI-based nanocomposites developed in this study demonstrate potential as packaging materials in high-performance electronics. The optimization of nanoparticle loading and dispersion enhances the material’s thermal and mechanical properties, providing a pathway for advanced electronic packaging applications.