Publication: A design and analysis of mems relay for electronic packaging application
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Date
2006-03-01
Authors
Mohd Kamal, Abu Hanifah
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Abstract
There are many researches and developments (R&D) about Micro-Electro-Mechanical
System (MEMS) have been done and this field is developing. By seeing this, we also
have done research about MEMS and our research is about ‘A design and analysis of
MEMS relay for electronic packaging.’ The objective is to improve the performance of
relay in operation. The research is more about modification of relay which is GRF172 in
dimension and material property and application of thermal stress to the relays. The
modification relay will be compared to origin relay to see which relay has the best
performance in electronic packaging. The relay which has been modified both in
dimension and material property has the best performance.