Publication:
A design and analysis of mems relay for electronic packaging application

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datacite.subject.fosoecd::Engineering and technology::Mechanical engineering
dc.contributor.authorMohd Kamal, Abu Hanifah
dc.date.accessioned2024-10-17T01:51:25Z
dc.date.available2024-10-17T01:51:25Z
dc.date.issued2006-03-01
dc.description.abstractThere are many researches and developments (R&D) about Micro-Electro-Mechanical System (MEMS) have been done and this field is developing. By seeing this, we also have done research about MEMS and our research is about ‘A design and analysis of MEMS relay for electronic packaging.’ The objective is to improve the performance of relay in operation. The research is more about modification of relay which is GRF172 in dimension and material property and application of thermal stress to the relays. The modification relay will be compared to origin relay to see which relay has the best performance in electronic packaging. The relay which has been modified both in dimension and material property has the best performance.
dc.identifier.urihttps://erepo.usm.my/handle/123456789/20765
dc.language.isoen
dc.titleA design and analysis of mems relay for electronic packaging application
dc.typeResource Types::text::report
dspace.entity.typePublication
oairecerif.author.affiliationUniversiti Sains Malaysia
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