Publication: Mengenalpasti kemungkinan lokasi retak di dalam pakej elektronik menerusi simulasi kaedah unsur terhingga
Date
2001-02-01
Authors
Muhamad, Muzkhairil
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Abstract
Crack occurs in every material even with detail examination is done during the manufacturing process. In case of electronic packaging, crack plays a vital role due its function on the surface, which is exposed to temperature changes. Today, study on crack and its characteristic is very important especially in research and design aspect. Research analysis is carried out in order to locate any position within the electronic package that have a high crack possibility using finite element simulation method. Analysis is done using Ideas Master Series 6A software where the result of simulation is extracted for calculation of the Strain Energy Release Rate, G and Stress Intensity Factor, K using Modified Crack Closure Integral (MCCI) method. The main objectives of this research are:
1) Exposure to electronic packaging involving the type, manufacturing procedure,
function and market.
2) Further understanding on fracture mechanics concept in electronic packaging
especially on linear elastic fracture mechanics (LEFM).
3) Upgrade literacy on Ideas Master Series 6A especially for finite element
simulation.
4) Used MCCI method to calculate G and K. The calculation is based on data from
Finite Element Simulation.
5) Research on package model of 208-LD QFP.
For this research analysis, 12 models of crack location in QFP package have been chosen. Evaluation is done based on the value of G for each crack location which is calculated using MCCI based on data from Ideas simulation. From the analysis, we found that the parameters affecting the result are coefficient of
thermal expansion , a and Young Modulus, E of the component especially on the contact surface of different components. The big difference of those parameters on the contact surface lead to high value of G. In addition, the location and the size of the crack do affect the value of G.