Publication: Effect of gold wire configuration and epoxy material on light-emitting diode encapsulation process
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Date
2023-07
Authors
Chooi, Jing Qi
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Abstract
This research aimed to investigate the effect of epoxy material and different wire configurations on the total maximum deformation, maximum equivalent elastic strain and maximum von Mises stresses on the Light-Emitting Diode (LED) Encapsulation Process. The LED encapsulation process simulation was simulated using the Volume of Fluid (VOF), Fluid-Structure Interaction (FSI) and System Coupling methods in ANSYS. The five different viscosities of the epoxy moulding compound—EMC (0.448 𝑘𝑔/𝑚𝑠), S7524 (0.23 𝑘𝑔/𝑚𝑠), S7144 (0.35 𝑘𝑔/𝑚𝑠), D9980 (0.6 𝑘𝑔/𝑚𝑠), and S7515 (0.7 𝑘𝑔/𝑚𝑠) on the LED encapsulation process were simulated over five time periods of 0%, 10%, 25%, 60% and 100% using ANSYS's VOF model with the UDF. The results of simulations using a fluid with a viscosity of 0.448 𝑘𝑔/𝑚𝑠 were validated with the results of an experiment using an epoxy moulding compound (EMC), which has the same viscosity. Next, the effect of five different gold wire configurations—S-loop, Q-loop, M-loop, Square-loop, and Triangle-loop on the LED encapsulation process was studied using the FSI model with UDF. The results showed the EMC epoxy at 0.448 𝑘𝑔/𝑚𝑠 viscosity formed a precise hemispheric shape on the LED substrate in 100% of the time. The EMC epoxy (0.448 𝑘𝑔/𝑚𝑠) had the most consistent growing trend for the water volume fraction throughout the flow time, indicating that it was the most stable epoxy during the LED encapsulation process. For the effect of five different gold wire configurations on the LED encapsulation process, the Q-loop wire reacted well to the EMC since it had the highest maximum equivalent elastic strain and von Mises stress, but it had the second-highest maximum total deformation. Next, the Square-loop wire was the best gold wire configuration as it had the lowest maximum total deformation, equivalent elastic strain, and von Mises stress. The best performance of the wire configuration to the EMC during the LED encapsulation process is Square-loop followed by Triangle-loop, S-loop, Q-loop, and M-loop.