Heat pipes in electronic packaging
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Date
2006
Authors
Munusamy, Sri Jaiandran
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Abstract
The electronic industry is developing towards higher quality and
computational speed. It has led to the increase in chip heat fluxes. Therefore,
the challenge has come for the engineers to overcome the problem in chip
packaging. Among all the cooling methods, heat pipe is a better selection
because of its high efficiency and reliability. Therefore, further studies have
been carried out to understand the behavior of heat pipe with different
parameter. The first part of the research consists of fabrication of various
sizes of heat pipes and applies variable heat input. Therefore it’s
characteristic and the heat dissipation of heat pipe along a certain length can
be obtained. More over, studies are done by increasing number of heat
sources and to identify its temperature distribution along the heat pipe. The
research shows that, then maximum temperature increases when heat input
increases and average temperature drop for all entire case is ± 7°C. This
result is in an acceptable range for well designed heat pipe. Secondly, Finite
Element Method is developed through MATLAB 6.0 and to simulate the
predicted thermal model which has the similar features with the experiment.
This predicted thermal model is later used to compare and verify with the
experimental results. The analysis done shows that the variation between
both experimental values and predicted values are very minimal and it is
around ± 4°C. Thus, this strongly proves that the experiment is correctly done
and further enhancement can be done for future application. Final part of the
research is about application of heat pipes in power dissipation of cellular
phones. In the case of cellular phone, micro heat pipe is used to transfer heat
from heat spreader to casing and antenna. ANSYS is used to simulate the
heat dissipation on the heat spreader. Several parameters have been studied
to obtain the optimal heat dissipation along the heat spreader. The simulation
is based on four different parameters, which are number of heat pipes,
spacing between heat pipes, numbers of heat sources and heat generation
rate. With parametric study, more information on heat dissipation along heat
spreader of cellular phone can be gained. This method helps in achieving
better power dissipation in portable electronic products.
Description
Master
Keywords
Science , Heat pipes , electronic packaging