Heat pipes in electronic packaging
| dc.contributor.author | Munusamy, Sri Jaiandran | |
| dc.date.accessioned | 2014-11-18T07:46:54Z | |
| dc.date.available | 2014-11-18T07:46:54Z | |
| dc.date.issued | 2006 | |
| dc.description | Master | en_US |
| dc.description.abstract | The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. Therefore, the challenge has come for the engineers to overcome the problem in chip packaging. Among all the cooling methods, heat pipe is a better selection because of its high efficiency and reliability. Therefore, further studies have been carried out to understand the behavior of heat pipe with different parameter. The first part of the research consists of fabrication of various sizes of heat pipes and applies variable heat input. Therefore it’s characteristic and the heat dissipation of heat pipe along a certain length can be obtained. More over, studies are done by increasing number of heat sources and to identify its temperature distribution along the heat pipe. The research shows that, then maximum temperature increases when heat input increases and average temperature drop for all entire case is ± 7°C. This result is in an acceptable range for well designed heat pipe. Secondly, Finite Element Method is developed through MATLAB 6.0 and to simulate the predicted thermal model which has the similar features with the experiment. This predicted thermal model is later used to compare and verify with the experimental results. The analysis done shows that the variation between both experimental values and predicted values are very minimal and it is around ± 4°C. Thus, this strongly proves that the experiment is correctly done and further enhancement can be done for future application. Final part of the research is about application of heat pipes in power dissipation of cellular phones. In the case of cellular phone, micro heat pipe is used to transfer heat from heat spreader to casing and antenna. ANSYS is used to simulate the heat dissipation on the heat spreader. Several parameters have been studied to obtain the optimal heat dissipation along the heat spreader. The simulation is based on four different parameters, which are number of heat pipes, spacing between heat pipes, numbers of heat sources and heat generation rate. With parametric study, more information on heat dissipation along heat spreader of cellular phone can be gained. This method helps in achieving better power dissipation in portable electronic products. | en_US |
| dc.identifier.uri | http://hdl.handle.net/123456789/571 | |
| dc.language.iso | en | en_US |
| dc.subject | Science | en_US |
| dc.subject | Heat pipes | en_US |
| dc.subject | electronic packaging | en_US |
| dc.title | Heat pipes in electronic packaging | en_US |
| dc.type | Thesis | en_US |
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