Finding temperature distribution pattern in PILC cable with void defect by using comsol multiphysics

dc.contributor.author	Siti Faridah Satar
dc.date.accessioned	2021-04-20T02:17:45Z
dc.date.available	2021-04-20T02:17:45Z
dc.date.issued	2017-06
dc.description.abstract	A power system with high voltage transmission is necessary to transmit a large amount of electrical energy from generating stations to consumers. Insulation is the most important part of high voltage system together with cable and machine. In order to keep the equipment in good operating condition, it is necessary to maintain the insulation in the equipment. In particular condition, heat and other form of energy are released during the discharge activities which may degrade the performance of the insulation. In this paper, the temperature distribution pattern in the insulation of PILC cable is studied in order to help in determining the location of discharge activities. In particular, the effect of the size and location of the void in the insulation are investigated by using COMSOL Multiphysics. The result shows the amount of heat pattern is affected by the size and location of the void in the insulation. The finding show that, the smaller size of void and the nearer void to the conductor made the insulator more heated and leading the cable to breakdown.	en_US
dc.identifier.uri	http://hdl.handle.net/123456789/12957
dc.language.iso	en	en_US
dc.title	Finding temperature distribution pattern in PILC cable with void defect by using comsol multiphysics	en_US
dc.type	Other	en_US

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