Surface analysis of bond pad flower-like defects in wafer fabrication
| dc.contributor.author | Lim, Boon Hoe | |
| dc.date.accessioned | 2016-11-01T03:10:09Z | |
| dc.date.available | 2016-11-01T03:10:09Z | |
| dc.date.issued | 2004-04 | |
| dc.description.abstract | The flower-like defects (FLD) at integrated circuit (Ie) bond pads will cause yield and reliability problems in wire bonding process such as non-stick bond pad and bond pad corrosion. The objec.ti ve of this research is to perform in-depth surface and profile characterization on the FLD so that its root cause and mechanism of formation are understood in order to recommend possible preventions and solutions. The FLD were analysed with optical microscopy and surface analytical techniques such as SEM, quantitative EDS, FIB cross sectioning and grain imaging contrast and its potential to grow was closely monitored. The EDS analysis result revealed high fluorine and oxygen content on FLD. Fluorine residual from plasma etch process gases on bond pads and wet cleaning inefficiency are the root causes. Aluminium reacts with fluorine and then with water or moisture to gradually and progressively form compounds mixture of AIF3 (aluminium fluoride), AI(OF)x (aluminium oxy-fluoride), AI(OH)3 (aluminium hydroxide) and AIF3.xH20 (aluminium fluoride hydrate) on bond pads that eventually delaminate from the surface. Possible preventions and solutions employed were cleaning efficiency improvement, stringent wafer storage conditions li!<e vacuum-sealed with moisture barrier bag and kept in nitrogen-purged cabinet and environmental factors (relative humidity, temperature and air-flow) controlled. With these measures, no FLD were seen on bond pads after 10 1 days in nitrogen-purged cabinet. | en_US |
| dc.identifier.uri | http://hdl.handle.net/123456789/2938 | |
| dc.subject | The flower-like defects (FLD) at integrated circuit (Ie) bond pads | en_US |
| dc.subject | will cause yield and reliability problems in wire bonding process | en_US |
| dc.title | Surface analysis of bond pad flower-like defects in wafer fabrication | en_US |
| dc.type | Thesis | en_US |
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