Investigation of low dielectric constant (k) films for deep sub-micron CMOS application.
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Date
2007
Authors
Kuan Yew, Cheon'g
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Abstract
Silica (Si02) thin film on Si with low dielectric constant (k) properties has been systematically prepared and investigated. Two types of this low-k material have been deposited on Si via sol-gel spin-on coating.
Filem nipis silika (Si02) yang berpemalar dieletrik rendah endap di atas Si tlah disediakan dan dikaji dengan sistematik. Dua jenis film nipis telah disediakan menggunkan pemutaran sol-gel.
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Keywords
Pengendapan Sol-gel , Sol-gel deposition , Pemalar dieletrik rendah , Low dielectric constant , Filem nipis , Thin filem