Heat generation transport in micro and sub- micro scale in electronic packaging
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Date
2003-05
Authors
Ooi, Chun Keang
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Abstract
Energy exchange takes place in extremely small dimension and time scale in the process
of micro-electronic packaging. For fast heating response, Fourier conduction law is
inadequate to explain the phenomena. Thus, an alternative law is introduced to
compensate the Fourier law, named as Non-Fourier law. Non-Fourier law, based on
two-phase-Iag model has introduced two new assumptions, to eliminate the drawbacks
from classical Fourier heat conduction equation when applied to .rapid heating process.
These assumptions are finite thermal wave propagation speeds and time of equilibrium
between electron and lattice. From previous research on dual phase-lag model, different
governing equations have to employ for different boundary conditions. but with a
proposed two phase-lag model only a single governing equation is adequate. These
phase lags are the phase lag for temperature gradient (TT) and heat tlux (Tq). A finite
element method and Runge-Kutta method are applied in the development of three-dimensional
Non-Fourier heat conduction model. Three-dimensional model predicted a
lower temperature values as compared with one-dimensional and two-dimensional
model. The application of two phase-lag model to very-Iarge-scale-integrated (VLSI)
interconnect thermal analysis, illustrates that circuit open failure occurs at current pulse
of 300ns. An implementation of Asymptotic Waveform Evaluation (A WE) scheme in
first and second order ordinary differential equation shows a break through as compared
with conventional methods. This advanced. powerful and efficient scheme shows
excellent results compared with Runge-Kutta method. central difference method and
ANSYS'I() 5.4, and is several orders faster.
Description
Keywords
Energy exchange takes place in extremely small dimension and time scale , in the process of micro-electronic packaging.