Investigation On Flexible Type Printed Circuit Board Electronics Using Fluid-Structure Interaction Technique

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dc.contributor.authorLeong, Wei Chiat
dc.date.accessioned2017-10-20T08:04:12Z
dc.date.available2017-10-20T08:04:12Z
dc.date.issued2014
dc.description.abstractThe electronic and microelectronic industries have been growing tremendously since a decade ago, in which printed circuit boards (PCB) play a very major role to act as platform for the products. In this new era, flexible printed circuit board (FPCB) can be used as an alternative to the rigid printed circuit board (RPCB). FPCB is advantageous in some applications because of its excellent flexibility, twistability, reduced thickness, and lightweight features. Nevertheless, the deflection and stress induced by FPCB in the flow environment are far more prominent and critical compared to the traditional RPCB. At this juncture, in a flow environment, although the induced deflection and stress are often ignored for RPCB, these are key factors affecting the reliability of FPCB. In the present work, the study aims to tackle on these topics to investigate the fluid-structure interaction (FSI) behaviours of FPCB under different flow conditions. Many effects were explored on a typical general FPCB electronic including effects of flow velocity, component factors, component array, misalignment, inclination and mounting, followed by the optimization via response surface methodology (RSM). These parametric factors were found to be significantly influencing the deflection and stress levels of FPCB. On the basis of the results, a few design strategies are also suggested to the interests of FPCB designers or engineers, in order to develop more reliable and convincing products. Apart from that, a feasibility case study was also carried out on a proposed new FPCB motherboard application, which utilized FPCB as substrate for the PC motherboard. The case study was intended to discover the potential and performance of FPCB in the actual application. In the present study, the FSI study was performed using the fluid solver FLUENT and the structural solver ABAQUS, coupled online by the Mesh-based Parallel Code Coupling Interface (MpCCI). An experiment was also conducted to validate the FSI numerical results. It was found that FPCB response was indeed sensitive to various factors under the flow environment, which then affected its induced deflection and stress levels. The highest deflection and stress obtained could attain at 2.05 mm and 14.2 MPa, respectively. Comparing with FPCB yield strength (84 MPa), the FPCB can be regarded as the prospective and possible potential platform in the future electronic development. The research findings in the present study are believed to be valuable and can add significant contribution toward the development of FPCB industries. The knowledge can be applied and used as a fundamental reference to wide area of FPCB applications, particularly when dealing with FSI phenomenon.en_US
dc.identifier.urihttp://hdl.handle.net/123456789/5043
dc.language.isoenen_US
dc.publisherUniversiti Sains Malaysiaen_US
dc.subjectelectronicsen_US
dc.subjectmotherboarden_US
dc.titleInvestigation On Flexible Type Printed Circuit Board Electronics Using Fluid-Structure Interaction Techniqueen_US
dc.typeThesisen_US
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