Properties Of Silver Filled Epoxy Composites For Electrical Conductive Adhesive Applications

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dc.contributor.authorShariff, Khairul Anuar
dc.date.accessioned2018-08-29T02:00:34Z
dc.date.available2018-08-29T02:00:34Z
dc.date.issued2011-06
dc.description.abstractThe study aims to improve the electrical conductivity, thermal and flexural properties of silver filled epoxy composites for electrical conductive adhesive applications. In order to achieve the main aim, few parameters such as effect of hardener content, comparison on two types of silver filler and hybrid silver filled epoxy composites were investigated. It is found that 21 phr and 18 phr of hardener content in the epoxy give an optimum flexural modulus and flexural strength, respectively. CTE and DMA analysis shows that the 15 phr of hardener content give the lowest CTE value, highest storage modulus and high Tg. Second part of the research involves the production of electrical conductive adhesives. One-part electrical conductive adhesives are prepared by using two types of silver (silver SF 135 and silver SF 499). It is observed that the silver SF 135 adhesives systems exhibits higher electrical conductivity with lower percolation thresholds, higher flexural modulus, and lower coefficient of thermal expansion (CTE) compared with silver SF 499 adhesive system. Furthermore application of Silver SF 135 in one-part and two-part epoxy systems was carried out. One-part epoxy system exhibits better electrical conductivity and thermal expansion properties compared with two-part epoxy system. The third part of the study covers on the hybrid silver filled epoxy composites. Results indicate that addition of 0.4 vol.% of nanosilver with constant 30 vol.% silver SF 135 in epoxy resin give 11% increased of electrical conductivity value compared with 1.5 vol.% of nanosilver addition. In short, due to the higher electrical conductivity, CTE and Tg, one-part epoxy system, silver SF 135 and hybridization between micron-size and nano-size of silver is recommended for the production of electrical conductive adhesives.en_US
dc.identifier.urihttp://hdl.handle.net/123456789/6449
dc.language.isoenen_US
dc.publisherUniversiti Sains Malaysiaen_US
dc.subjectProperties of silver filled epoxy compositesen_US
dc.subjectfor electrical conductive adhesive applicationsen_US
dc.titleProperties Of Silver Filled Epoxy Composites For Electrical Conductive Adhesive Applicationsen_US
dc.typeThesisen_US
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