Study Of Wave Soldering Using Thermal-Fluid Structure Interaction Technique On Pin Through Hole In Printed Circuit Board
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Date
2015-08-05
Authors
Abdul Aziz, Mohd Sharizal
Journal Title
Journal ISSN
Volume Title
Publisher
Universiti Sains Malaysia
Abstract
Wave soldering is one of the most familiar and well-established processes in the
electronics assembly industry, which is used to assemble the pin-through hole (PTH)
component onto the printed circuit board (PCB). The solder joint defects such as cracks,
void formation, and incomplete filling of the PCB hole may weaken the PTH solder
joint. In the present research, the PTH vertical fill was carried out experimentally by
using a newly developed adjustable fountain wave soldering machine (0° conveyor
angle). A similar PCB and components were assembled by using a conventional wave
soldering machine (6° conveyor angle). A non-destructive X-ray computed tomography-scanning machine was employed to inspect the vertical fill of each solder joint. On the other hand, the wave soldering process considering thermal-FSI phenomenon was the focus on this research. The thermal-FSI simulation was carried out by using finite volume (FLUENT) and finite element (ABAQUS) based software through the real time
coupling technique using Mesh-based parallel Code Coupling Interface (MpCCI)
software. It was found that the adjustable fountain wave soldering yielded higher vertical
fill (~99.4%) than the conventional wave soldering machine (~90.8%). Apart from that,
the simulations were broadening to the parametric studies on various process and design
factors such as conveyor angle and PTH geometry (i.e. offset position, shape, diameter,
offset angle). The influences of these parameters on the fluid flow distribution, structural
displacement, pressure distribution, and stress have been highlighted. Moreover the
optimization of PTH connector in the wave soldering process using response surface
methodology (RSM) was handled to study the interactive relationship between
independent variables to the responses. The optimum geometrical and process
parameters for the PCB and PTH connector were characterized by 0.12 mm of PTH
offset position, 0.17 mm of PTH diameter, 0' of offset angle and 473.15 K of molten
solder temperature. Finally the case study on the effects of PCB configuration during
wave soldering was investigated. Five PCB configurations were considered based on the
position of the components. Results show that PCB component configurations
significantly influence the PCB and yield unfavorable deformation and stress. The
research findings are expected to be significant contributions in for the microelectronic
industry.