Intermetallic Compound And Reliability Study Of SAC And SNBI Lead Free Solders
| dc.contributor.author | Abdul Wahab, Abdul Karim | |
| dc.date.accessioned | 2018-11-29T07:17:34Z | |
| dc.date.available | 2018-11-29T07:17:34Z | |
| dc.date.issued | 2011-05 | |
| dc.description.abstract | Due to the environmental concern for lead toxicity, the use of lead-free solder has been widespread in electronic packaging industries. In order for lead-free solder to replace the current lead solder, lead-free solder should have as close melting point as lead solder (1830C) and also has good wettability, excellent physical and mechanical properties. This thesis is devoted to the research and development of lead-free Sn-Bi and SAC based solder alloy for microelectronic packaging applications. A systematic study was conducted on the solders characteristics, wetting behavior, the interfacial reaction, mechanical properties and growth kinetics of solders on Cu and Ni-P substrate. The IMCs formed at the interface between the solder and Cu substrate were identified as Cu6Sn5, Cu3Sn, AgZn and Cu5Zn8, and for Ni-P substrate were Ni3Sn4 and (Ni,Cu)6Sn5 and the thickness of IMCs increased with thermal aging. Addition of 0.5% Cu and 0.5% Ag improved the wettability on both Cu and Ni-P substrate by reducing the surface tension of molten solders and also increased conductivity of solder alloys. Whereas, addition of In, Zn and Bi in SAC based solder reduced the melting point and gave better wettability to the solder. Either additions of 4% Bi or 9%In in SAC solder reduce the rate of IMC growth during aging process on both Cu and Ni-P substrate, and therefore improved the reliability of solder joint. Despite the relatively higher coefficient thermal expansion result, it was found that Sn79Bi20Ag0.5Cu0.5, Sn77.5Bi20Ag0.5Cu2.0, Sn87Ag3.5Cu0.5In9 and Sn87Ag3.5Cu0.5In5Zn4 may be the best candidates to replace tin-lead solder due to excellent wettability, lower wetting angle, lower melting point and higher strength compared to SAC (355) solder. | en_US |
| dc.identifier.uri | http://hdl.handle.net/123456789/7156 | |
| dc.language.iso | en | en_US |
| dc.publisher | Universiti Sains Malaysia | en_US |
| dc.subject | The research and development of lead-free | en_US |
| dc.subject | Sn-Bi and SAC based solder alloy | en_US |
| dc.title | Intermetallic Compound And Reliability Study Of SAC And SNBI Lead Free Solders | en_US |
| dc.type | Thesis | en_US |
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