Experimental And Numerical Studies On Thermal Analysis Of Heat Pipes For Computer Cooling Applications

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dc.contributor.authorElnaggar, Mohamed H. A.
dc.date.accessioned2019-06-25T01:22:08Z
dc.date.available2019-06-25T01:22:08Z
dc.date.issued2012-07
dc.description.abstractIn computer industry, the growing development and demand for processing power necessitate efficient design of processors to conduct operations faster; consequently, the need for cooling techniques to dissipate the associated heat is quite obvious. Hence, it is highly desirable to explore high-performance cooling devices, especially for CPU cooling. In the present study, multi and twin U-shape vertical heat pipes, and single L-shape horizontal heat pipe, were investigated experimentally and numerically. Thermal analysis was performed under both natural and forced convection modes. The simulations were carried out in two models; the first was 3D model based on the heat transfer by conduction where the heat pipe as a whole was modeled by assuming it as a conducting medium, without taking into account the events occurring inside the heat pipe. The second was 2D model to characterize the working fluid inside the heat pipe. As an excellent tool for experimental design and optimization, design of experiment (DOE) was employed to optimize the coolant velocity and the heat input to get the best performance of the heat pipe. The results show that the air velocity and power input have important effect on the performance of finned heat pipes. The total thermal resistance decreases with increase in heat input and coolant velocity. The lowest value of the total thermal resistances for finned U-shape multi heat pipe, twin heat pipe and single L-shape heat pipe are 0.181 °C/W, 0.125°C/W and 0.533 °C/W respectively.en_US
dc.identifier.urihttp://hdl.handle.net/123456789/8363
dc.language.isoenen_US
dc.publisherUniversiti Sains Malaysiaen_US
dc.subjectThermal analysis of heat pipesen_US
dc.subjectfor computer cooling applicationsen_US
dc.titleExperimental And Numerical Studies On Thermal Analysis Of Heat Pipes For Computer Cooling Applicationsen_US
dc.typeThesisen_US
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