RELIABILITY ANALYSIS ON FAlLURE INVESTIGATION TIME
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Date
2008
Authors
LUK, LOW PEI
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Abstract
A short throughput time (TPT) to complete a full failure investigation (commonly known
as failure analysis) flow is essential in providing semiconductor companies with an edge
over its competitors in the semiconductor market. Throughput time covers one cycle of
failure investigation flow, from the moment a sample arrives until a result is obtained,
whether there are any defect found which is able to improve and explain the failure or
whether there are no defect found, which will not contribute to any root cause fix.
However, this flow requires different approaches, where a variety of techniques are
needed. In this paper, the failure analysis process cycle time is used in the context of
failure time; the time to comp!ete the failure investigation was taken; defect found is the
event of success Therefore, a series reliability analysis is carried out by fitting the process
times through parametric distribution fitting, nonparametric estimates (Kaplan-Meier
estimation) in conjunction with survival curves equality test (Logrank and Wilcoxon
tests), failure time regression analysis including the exponential regression model and
Cox proportional hazards model, logistic regression with Hosmer-Lemeshow goodnessof-
fit test together with the model selection criterion (AIC, SC and -2 Log L). Failure
investigation process times from the studied manufacturing site is best fitted to the
exponential distribution with a constant completion rate at 4. 7 per day. There is no strong
evidence to say that the worker's job grade and sample failure type have significant
difference on the survival curves. The new product design process is believed to have a
shorter process time than the old one as it is being prioritized in the failure investigation
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RELIABILITY ANALYSIS ON FAlLURE