RELIABILITY ANALYSIS ON FAlLURE INVESTIGATION TIME

dc.contributor.authorLUK, LOW PEI
dc.date.accessioned2016-01-12T03:30:54Z
dc.date.available2016-01-12T03:30:54Z
dc.date.issued2008
dc.description.abstractA short throughput time (TPT) to complete a full failure investigation (commonly known as failure analysis) flow is essential in providing semiconductor companies with an edge over its competitors in the semiconductor market. Throughput time covers one cycle of failure investigation flow, from the moment a sample arrives until a result is obtained, whether there are any defect found which is able to improve and explain the failure or whether there are no defect found, which will not contribute to any root cause fix. However, this flow requires different approaches, where a variety of techniques are needed. In this paper, the failure analysis process cycle time is used in the context of failure time; the time to comp!ete the failure investigation was taken; defect found is the event of success Therefore, a series reliability analysis is carried out by fitting the process times through parametric distribution fitting, nonparametric estimates (Kaplan-Meier estimation) in conjunction with survival curves equality test (Logrank and Wilcoxon tests), failure time regression analysis including the exponential regression model and Cox proportional hazards model, logistic regression with Hosmer-Lemeshow goodnessof- fit test together with the model selection criterion (AIC, SC and -2 Log L). Failure investigation process times from the studied manufacturing site is best fitted to the exponential distribution with a constant completion rate at 4. 7 per day. There is no strong evidence to say that the worker's job grade and sample failure type have significant difference on the survival curves. The new product design process is believed to have a shorter process time than the old one as it is being prioritized in the failure investigationen_US
dc.identifier.urihttp://hdl.handle.net/123456789/1390
dc.subjectRELIABILITY ANALYSIS ON FAlLUREen_US
dc.titleRELIABILITY ANALYSIS ON FAlLURE INVESTIGATION TIMEen_US
dc.typeThesisen_US
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