Numerical And Experimental Analyses Of Piezoelectric Fans For Microelectronics Cooling

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Date
2010-06
Authors
Ramana, Maram Venkata
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Publisher
Universiti Sains Malaysia
Abstract
With the advancement of science and technology, electronic products work faster and perform more functions. Also electronic products are shrinking in size and weight that have increased volumetric heat generation rates and surface heat fluxes over their components. Hence, it is important to develop a new cooling technology to improve performance of microelectronic components, which motivates the usage of cantilever type piezoelectric bimorph structure as a miniature fan. These piezoelectric bimorph structures have been investigated as alternative cooling mechanism for cooling microelectronic components. Parameters such as length, thickness, width and location of the piezoceramic layer to perform at the optimum level are studied here in. This process involves solving static, modal and harmonic simulations repeatedly. To understand the mechanical behavior of the bimorph structure, its static, modal and harmonic analysis are performed using ANSYS. The product of first ultrasonic resonance frequency with the corresponding dynamic tip-deflection has been used to represent the performance merit (PM). In order to achieve maximum cooling effect, performance merit has been studied and optimized with an integrated neuro-genetic approach (ANN-GA) has been applied to optimize the piezoelectric resonating bimorph structure. The 3D conjugate heat transfer analyses have been performed out using CFD software FLUENT to understand the efficiency and reliability of the integrated circuits in the micro electronic systems. The flow visualization technique (PIV) is used to asses the function of the piezoelectric fan. It is found that the deflection of the bimorph greatly influences the temperature behavior of the piezoelectric strain coefficient. The applied electric field only affect on tip-deflection.
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Keywords
Piezoelectric fans for , microelectronics cooling
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