Investigation Of Wire Sweep During Pbga Encapsulation Process Using Fluid Structure Interaction

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dc.contributor.authorRamdan, Dadan
dc.date.accessioned2019-08-20T07:12:25Z
dc.date.available2019-08-20T07:12:25Z
dc.date.issued2013-07
dc.description.abstractThe reduction of IC chip size has a significant impact to the modern electronic industry especially on the circuit design and IC assembly process. The increasing of I/O counts in a small scale IC chip result in severe wire deformation and deformation issues during transfer moulding process. In this research, visualization of wire sweep phenomenon during the encapsulation process of plastic ball grid array (PBGA) package is studied through a three-dimensional (3D) fluid structure interaction (FSI) technique; which FV- and FE-based software are connected by using mesh-based parallel code coupling interface (MpCCI). The effect of polymer rheology, inlet pressure, arrangement of inlet gate, number of stacked die, wire diameter and size of mould cavity vents, on the melt flow behaviour, wire sweep, filling time, cavity pressure and stress distributions, are mainly studied. A 3D model of mould and wires was created by using GAMBIT, and the fluid/structure interaction was simulated by using FLUENT and ABAQUS software integrated with MpCCI for the real-time calculations. The Castro-Macosko model and Kamal model are used to incorporate the polymer rheology and the Volume of Fluid (VOF) technique is applied for melt front tracking. User-defined functions (UDFs) were incorporated to allow the curing kinetics.en_US
dc.identifier.urihttp://hdl.handle.net/123456789/8647
dc.language.isoenen_US
dc.publisherUniversiti Sains Malaysiaen_US
dc.subjectWire Sweep During Pbgaen_US
dc.subjectFluid Structure Interactionen_US
dc.titleInvestigation Of Wire Sweep During Pbga Encapsulation Process Using Fluid Structure Interactionen_US
dc.typeThesisen_US
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