Modeling and simulation for transient thermal analysis using the latency insertion method
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Date
2019-06
Authors
New Boon Chun
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Abstract
In this thesis, a modeling technique of thermal equivalent circuit is proposed and combined with a Latency Insertion Method to find the temperature distribution of the thermal problem. The research is focused into the thermal analysis performance by modeling and simulation of thermal equivalent circuit. In this project, a thermal problem representing an IC structure is set-up first. Next, it is modeled into the thermal equivalent circuit with elements such as thermal resistance and thermal capacitance by using analogy between thermal system and electrical system. The circuit is then simulated with a fasttransient simulation algorithm which is Latency Insertion Method (LIM). A numerical stability condition is established to guarantee the stability of LIM algorithm with a small time-step size is used. For the result, the transient thermal response of the thermal equivalent circuit will be shown. The transient response is a stable exponential shape in which its steady state at around 80°C with a time step of 28ns. Besides, there will be a color map shows the temperature distribution of the thermal sample problem. For the simulation of thermal equivalent circuit, different time steps are used to analyse the stability of LIM algorithm. In overall, LIM algorithm has shown its strength on the accuracy when the simulation condition is stable. However, it has limitation on stability criteria as it needs a small time step to achieve its stability condition.