Application of comsol multiphysics in finding temperature distribution pattern EPR cable with presence of void
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Date
2017-06
Authors
Nurun Najah Binti Abdul Rahim
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Abstract
Presence of void usually initiate the partial discharges activity in the insulator. Heat and other form of energy are released during discharges activity which eventually lead to degradation of insulator. It is very important to detect the presence of discharges activity in order to carry out proper preventive maintenance. In this paper, the temperature distribution pattern is investigated in relation to different size, location from conductor and electric potential of void. Differences in temperature indicated the location of void either it is located near conductor, middle of insulator or near sheath of the cable. The cable model has been modelled using COMSOL Multiphysics Version 5.2. Relationship between void and temperature distribution pattern has been made. The smaller the void size and the nearer the void to conductor, the higher the temperature value.