Properties Of Silver-Filled Epoxy Composites For Electronic Application Using Synthesized And Commercial Silver Nanoparticles

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dc.contributor.authorGhazali, Suriati
dc.date.accessioned2019-06-27T06:53:51Z
dc.date.available2019-06-27T06:53:51Z
dc.date.issued2012-07
dc.description.abstractIn this research, silver nanoparticles (SAgNPs) were synthesized by chemical reduction method while trisodium citrate and ascorbic acid were used as reducing agent and stabilizing agent, respectively. The effect of silver salt, reducing agent and stabilizing agent’s concentration were analyzed by TEM, SEM, EDX, XRD and UV-vis. Due to very low yield in obtaining SAgNP through synthesis route, composite sample was prepared in thin film form and compared with commercial silver; e.g. silver nanoparticles (CAgNPs) and silver flakes (CAgFs). The aims of this research are to study the effect of processing techniques, sizes and shapes of filler, hybrid between nano and micron size of Ag filler and filler treatment on electrical, mechanical, thermal properties and fracture surface of silver-filled epoxy composites for electronic application. The study firstly investigated on the properties of composites prepared by different processing techniques, e.g., manual and homogenizer mixing as function of filler loading (0 to 8 vol. %). Based on better flexural and electrical properties given by composite prepared by homogenizer mixing, this technique has been chosen in sample preparation of composite as a function of different size and shape of the filler, e.g., CAgFs (in micron meter size) and CAgNPs (in nanometer size). Flexural strength of the composite prepared by silver flakes decreased with increasing of silver content while composite prepared with silver nanoparticles shows an optimum at 4 vol. % before decreased with increasing filler content. Electrical conductivity of both composites prepared by silver flakes and silver nanoparticles show insulator-to-conductor behavior at 6 vol. %.en_US
dc.identifier.urihttp://hdl.handle.net/123456789/8422
dc.language.isoenen_US
dc.publisherUniversiti Sains Malaysiaen_US
dc.subjectProperties of silver-filled epoxy compositesen_US
dc.subjectusing commercial silver nanoparticlesen_US
dc.titleProperties Of Silver-Filled Epoxy Composites For Electronic Application Using Synthesized And Commercial Silver Nanoparticlesen_US
dc.typeThesisen_US
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