Fabrication And Properties Of Silica-Epoxy Thin Film Composite
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Date
2012-06
Authors
Foo, Yin Lin Evon
Journal Title
Journal ISSN
Volume Title
Publisher
Universiti Sains Malaysia
Abstract
With the increasing interest in high density electronics packaging, dimensional
scaling becomes the key to evolution. In this study, epoxy thin film composites with
silica fillers were fabricated using spin coating process. In the first part of this research,
the mechanical and thermal properties of the thin film composites using micron-silica
(µ-Si) and nano-silica (n-Si) fillers were compared. Low loading of n-Si thin film
composites was found to have the ability to achieve equivalent tensile and thermal
properties compared to the highly loaded µ-Si thin film composite. With higher surface
area to volume ratio, n-Si shows its capability to achieve a substantial performance with
-Si. In terms of curing agents, imidazole cured
thin film was found to have better mechanical and thermal properties due to the presence
of five membered ring in the imidazole chemical structure. The moisture absorption of
the imidazole cured samples were slightly higher than the polyetheramine cured samples
because imidazole cured resin is a polar resin. The dispersion of the n-Si filler was
improved by the treatment of n-Si with (3-Glycidyloxypropyl) trimethoxysilane
coupling agent. It was observed that 8 hours treatment time showed high mechanical
properties of the thin film composites. Prolong treatment time caused the drop in tensile
modulus and tensile strength but increase the flexibility of the thin film composites. The
presence of treated n-Si in the composite system causes the increase in the coefficient of
thermal expansion (CTE) value and lowers the thermal stability compared to the
untreated n-Si thin film composites. However, treatment of the n-Si was found to cause
the modification of the hydrophilic n-Si surface into a hydrophobic surface, thus reduced
the moisture absorption of the thin film composites.
Description
Keywords
Fabrication and properties of silica-epoxy , thin film composite