An optical set-up for inspecting edge chipping defects of dws solar wafer
| dc.contributor.author | Lim Thai Li | |
| dc.date.accessioned | 2021-11-16T08:25:03Z | |
| dc.date.available | 2021-11-16T08:25:03Z | |
| dc.date.issued | 2019-05-01 | |
| dc.description.abstract | Diamond-Wire Sawn (DWS) technique in Photovoltaic (PV) wafer slicing has the capability to slice out thinner wafers at a faster speed and lower kerf lost. However, thinner wafers will cause higher breakage rate. In-line inspection of defects such as wafer’s edge chipping has become more important. This research focuses on the optical set-up for silicon solar wafer’s edge chipping inspection system, resulting in the proposal of a novel set-up. It was discovered that the optimum camera set-up is at 45° and this angular view achieved surface visibility above 70% for all the three surfaces of a wafer’s edge, i.e., the top, side, and bottom surfaces. The use of dome light in the set-up was proven effective in generating best image quality for DWS surface with SNR of 14.4dB. Also, the back-lit illumination resulted in the best contrast averaging at 85.0%. The proposed set-up is applicable to run in-line on 353.7 mm/s of conveyor speed, which is equivalent to 4200 UPH production with the wafers pitch of 300 mm per unit. It achieved 100% detection for the three major types of chippings which are (i) the non-through, (ii) the through, and (iii) the side chipping, for chipping samples with size between 33 μm to 780 μm. The correctness of defect region segmentation scores 68.1% with false negative about 31.9% while the false positive maintained at 2.3%. | en_US |
| dc.identifier.uri | http://hdl.handle.net/123456789/14374 | |
| dc.language.iso | en | en_US |
| dc.title | An optical set-up for inspecting edge chipping defects of dws solar wafer | en_US |
| dc.type | Thesis | en_US |
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