Institut Penyelidikan dan Teknologi Nano Optoelektronik (INOR) - Tesis
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Browsing Institut Penyelidikan dan Teknologi Nano Optoelektronik (INOR) - Tesis by Subject "Gallium nitride"
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- PublicationImprovement Of Structural Design Of Algan/Gan Based Hemt For High Performance Power Devices(2025-02)Mihat, Muhaimin HaziqThis research focuses on the introduction of innovative structural designs aimed at addressing the multifaceted challenges associated with algan/gan hemts. Simulations are first validated against experimental data to ensure reliability. The investigated structures are then categorized into two; below and above the gate region. To address the high electric field concentrations near the metal contact edges, this thesis proposes new structural variations below the gate, which includes triple-trench, dual-notch, and an algan-graded channel with varied al composition along the channel. These approaches optimize the electric field distribution and reduce the likelihood of current collapse through enhanced mobility. Another focus is gate reliability, particularly gate leakage and on-state resistance through designs above the gate, such as a gate airgap, created by physically separating the metal contact from the semiconductor. Further optimizations include p-gan layer thickness, p-gan doping concentration, and device dimensions, balancing performance and reliability. This includes a comprehensive analysis of the trade-offs in gate length, gate-drain spacing, and surface passivation materials to reduce gate leakage, and a recessed p-gan gate is also developed for safer on-state operation. Overall, a 478% improvement in breakdown properties and a 403% increase in maximum drain current have been realized with the graded channel.
- PublicationIndium Gallium Nitride Based Light Emitting Diode Using Pre-Roughened Backside (N-Face) Gallium Nitride Substrate(2024-01)Alias, Ezzah AzimahThis project attempts to improve the performance of InGaN LEDs grown on GaN substrates. To achieve this goal, three frameworks were proposed. Firstly, by introducing GaN cap layer in multiquantum wells (MQWs). Secondly, by roughening backside (N-face) of GaN substrate using new etching solution and annealing the substrate before roughening. Thirdly, by roughening GaN substrate prior to LED growth.