Thermal investigations of flip chip microelectronic package with non-uniform power distribution
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Date
2004
Authors
Goh, Teck Joo
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Abstract
The trend in packaging microelectronic systems and subsystems has been to
reduce size and increase performance, both of which contribute to increase heat
generation. Evidence of this trend can be observed in higher level of integration in the
device/package level. Placing more functions in a smaller microelectronic
device/package has resulted in non-uniform power distribution with extreme heat
density, mandating that thermal management be given higher priority in the design
cycle in order to maintain the system performance and reliability.
In the present work, the methodology for thermal analysis and characterization
of a flip chip microelectronic package with non-uniform power distribution has been
developed. Though this topic is important to the industry, hardly any paper has been
published in the literature. Analytical methods, employing multiple linear regression
(MLR), temperature superposition, and Langrangian interpolation techniques, to predict
the temperature distribution of non-uniform powered microelectronic devices for
thermal analysis and genetic algorithms for optimization are introduced. These
methods are useful in investigating the thermal interactions of heat sources within the
silicon chip. Critical thermal parameters i.e. the heat source placement distance, level of
heat dissipation, and magnitude of convection heat transfer are examined in more than
900 simulations. Optimal placement of heat sources within silicon chip is being carried
out using genetic algorithms. The locations of this placement have been verified with
the finite element analysis.
Based on the analyses, comprehensive design procedures, rules and guidelines
for flip chip thermal test vehicles are developed. The requirements and the detailed
processes involved in the test chip design are discussed. Thermal studies have been
carried out to investigate the capability and limitations of thermal test vehicle designs
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in support of developing design guidelines. The validation and calibration procedures
of the described design structures for different thermal test vehicle applications have
been discussed in detail.
The present work also establishes a systematic experimental methodology to
quantify and characterize the thermal performance of flip chip microelectronic
device/package with non-uniform power distribution. The detailed procedures for
accurate, repeatable, and reproducible data and the method of attaching thermocouple
used in thermal experiments are outlined. The custom built measurement system for
gauging steady state performance of a given package thermal solution is described in
detail. The unique measurement capability analysis (MCA) on the thermal metrology to
demonstrate the stability and capability of the system and metrology set-up using stable
artifacts is introduced. The experimental methodology has been further demonstrated in
the package thermal characterization and optimization (through manufacturing process)
of two PentiumĀ® !!! XeonTM microprocessor designs with non-uniform power
distribution.
Description
Ph.D
Keywords
Science