Thermal investigations of flip chip microelectronic package with non-uniform power distribution
| dc.contributor.author | Goh, Teck Joo | |
| dc.date.accessioned | 2014-11-14T07:35:36Z | |
| dc.date.available | 2014-11-14T07:35:36Z | |
| dc.date.issued | 2004 | |
| dc.description | Ph.D | en_US |
| dc.description.abstract | The trend in packaging microelectronic systems and subsystems has been to reduce size and increase performance, both of which contribute to increase heat generation. Evidence of this trend can be observed in higher level of integration in the device/package level. Placing more functions in a smaller microelectronic device/package has resulted in non-uniform power distribution with extreme heat density, mandating that thermal management be given higher priority in the design cycle in order to maintain the system performance and reliability. In the present work, the methodology for thermal analysis and characterization of a flip chip microelectronic package with non-uniform power distribution has been developed. Though this topic is important to the industry, hardly any paper has been published in the literature. Analytical methods, employing multiple linear regression (MLR), temperature superposition, and Langrangian interpolation techniques, to predict the temperature distribution of non-uniform powered microelectronic devices for thermal analysis and genetic algorithms for optimization are introduced. These methods are useful in investigating the thermal interactions of heat sources within the silicon chip. Critical thermal parameters i.e. the heat source placement distance, level of heat dissipation, and magnitude of convection heat transfer are examined in more than 900 simulations. Optimal placement of heat sources within silicon chip is being carried out using genetic algorithms. The locations of this placement have been verified with the finite element analysis. Based on the analyses, comprehensive design procedures, rules and guidelines for flip chip thermal test vehicles are developed. The requirements and the detailed processes involved in the test chip design are discussed. Thermal studies have been carried out to investigate the capability and limitations of thermal test vehicle designs vii in support of developing design guidelines. The validation and calibration procedures of the described design structures for different thermal test vehicle applications have been discussed in detail. The present work also establishes a systematic experimental methodology to quantify and characterize the thermal performance of flip chip microelectronic device/package with non-uniform power distribution. The detailed procedures for accurate, repeatable, and reproducible data and the method of attaching thermocouple used in thermal experiments are outlined. The custom built measurement system for gauging steady state performance of a given package thermal solution is described in detail. The unique measurement capability analysis (MCA) on the thermal metrology to demonstrate the stability and capability of the system and metrology set-up using stable artifacts is introduced. The experimental methodology has been further demonstrated in the package thermal characterization and optimization (through manufacturing process) of two PentiumĀ® !!! XeonTM microprocessor designs with non-uniform power distribution. | en_US |
| dc.identifier.uri | http://hdl.handle.net/123456789/471 | |
| dc.language.iso | en | en_US |
| dc.subject | Science | en_US |
| dc.title | Thermal investigations of flip chip microelectronic package with non-uniform power distribution | en_US |
| dc.type | Thesis | en_US |
Files
License bundle
1 - 1 of 1
Loading...
- Name:
- license.txt
- Size:
- 1.71 KB
- Format:
- Item-specific license agreed upon to submission
- Description: