Free stream cooling on commercial microelectronic heat sink
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Date
2007-06
Authors
Ismail, Mohd Azmi
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Abstract
Heat sink is widely used to remove the heat from the microelectronic devices include
Pentium and AMD processor due to cheap, small power consumption and easy to install.
In the present study, five different types of heat sink have been used i.e. Pentium III,
Pentium Celeron, Pentium IV, AMD Athlon and AMD Duron heat sinks, in order to obtain
their performance. The effect of Reynolds numbers in the range of 2000 to 18000 on the
heat sinks performance is investigated. In this study, the comparisons of heat sinks for
Pentium and AMD families have been made by simulation and experiments. The simulation
has been made by CFD code Fluent 6.2 software to predict the performance of heat sinks.
An air chamber has been used in the experiment in order to supply approach air velocities to
the heat sinks. The simulation results obtained are shown in good agreement with the
experiment results. From the results, the Pentium IV heat sink has highest performance due
to lowest thermal impendence and pressure drop. It is found that the predicted values are
around ± 15% of the experimental results. The Nusselt number, temperature distributions,
pressure drop and thermal impendence against Reynolds numbers also have been
presented in this study.
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Keywords
Pentium IV heat sink has highest performance , due to lowest thermal impendence and pressure drop.