Free stream cooling on commercial microelectronic heat sink

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dc.contributor.authorIsmail, Mohd Azmi
dc.date.accessioned2016-11-07T06:59:08Z
dc.date.available2016-11-07T06:59:08Z
dc.date.issued2007-06
dc.description.abstractHeat sink is widely used to remove the heat from the microelectronic devices include Pentium and AMD processor due to cheap, small power consumption and easy to install. In the present study, five different types of heat sink have been used i.e. Pentium III, Pentium Celeron, Pentium IV, AMD Athlon and AMD Duron heat sinks, in order to obtain their performance. The effect of Reynolds numbers in the range of 2000 to 18000 on the heat sinks performance is investigated. In this study, the comparisons of heat sinks for Pentium and AMD families have been made by simulation and experiments. The simulation has been made by CFD code Fluent 6.2 software to predict the performance of heat sinks. An air chamber has been used in the experiment in order to supply approach air velocities to the heat sinks. The simulation results obtained are shown in good agreement with the experiment results. From the results, the Pentium IV heat sink has highest performance due to lowest thermal impendence and pressure drop. It is found that the predicted values are around ± 15% of the experimental results. The Nusselt number, temperature distributions, pressure drop and thermal impendence against Reynolds numbers also have been presented in this study.en_US
dc.identifier.urihttp://hdl.handle.net/123456789/3008
dc.subjectPentium IV heat sink has highest performanceen_US
dc.subjectdue to lowest thermal impendence and pressure drop.en_US
dc.titleFree stream cooling on commercial microelectronic heat sinken_US
dc.typeThesisen_US
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