Kajian berangka dan eksperimen bagi susun atur pakej pembawa plastik cip bertimbal (PLCC) yang dipasang sebaris secara mengufuk
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Date
2010-07
Authors
Mohamed, Mazlan
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Abstract
Nowadays, the power of semiconductor is increased tremendously for various
applications in electronic devices. Study of heat transfer on the semiconductor are
essential in order to make sure lifespan, reliability and performance of semiconductor
are higher. Generally, the heat transfer coefficient can be improved introducing force
convectioo method. PLCC are the most popular tool that removes heat from
semiconductor. Besides that, PLCC configuration and cooling system also can affect the
heat transfer coefficient. In this study, the effect of three differences PLCC
arrangements and gap between PLCC 3 cm and air inlet velocity in the range of 0.1 to
2.0 mls on the platform were investigated by experiment and simulation. The simulation
has been done by Fluent software, however experiment has been conducted by air
chamber. The results show that the Reynolds number proportional with the Nusselt
number. Moreover, PLCC arrangement and air inlet velocity increasing will increase
Nusselt number. Experimental results are lower than simulation results and leading
PLCC produce lower junction temperature compare with following PLCC. It happened
due to the effect of using screw to tighten the PLCC during the experimental process that
makes a little different between junction temperature of experiment and simulation.
Besides that, the surrounding of the experiment room also effect a little bit of the results
in the term of junction temperature. But the different is small and it is found that the
highest percentage difference between experimental results and simulation results were
lower than 10 percent.
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Keywords
The power of semiconductor is increased tremendously , for various applications in electronic devices.