Kajian berangka dan eksperimen bagi susun atur pakej pembawa plastik cip bertimbal (PLCC) yang dipasang sebaris secara mengufuk

Kajian berangka dan eksperimen bagi susun atur pakej pembawa plastik cip bertimbal (PLCC) yang dipasang sebaris secara mengufuk

Simple item page

dc.contributor.author	Mohamed, Mazlan
dc.date.accessioned	2016-11-03T01:06:59Z
dc.date.available	2016-11-03T01:06:59Z
dc.date.issued	2010-07
dc.description.abstract	Nowadays, the power of semiconductor is increased tremendously for various applications in electronic devices. Study of heat transfer on the semiconductor are essential in order to make sure lifespan, reliability and performance of semiconductor are higher. Generally, the heat transfer coefficient can be improved introducing force convectioo method. PLCC are the most popular tool that removes heat from semiconductor. Besides that, PLCC configuration and cooling system also can affect the heat transfer coefficient. In this study, the effect of three differences PLCC arrangements and gap between PLCC 3 cm and air inlet velocity in the range of 0.1 to 2.0 mls on the platform were investigated by experiment and simulation. The simulation has been done by Fluent software, however experiment has been conducted by air chamber. The results show that the Reynolds number proportional with the Nusselt number. Moreover, PLCC arrangement and air inlet velocity increasing will increase Nusselt number. Experimental results are lower than simulation results and leading PLCC produce lower junction temperature compare with following PLCC. It happened due to the effect of using screw to tighten the PLCC during the experimental process that makes a little different between junction temperature of experiment and simulation. Besides that, the surrounding of the experiment room also effect a little bit of the results in the term of junction temperature. But the different is small and it is found that the highest percentage difference between experimental results and simulation results were lower than 10 percent.	en_US
dc.identifier.uri	http://hdl.handle.net/123456789/2970
dc.subject	The power of semiconductor is increased tremendously	en_US
dc.subject	for various applications in electronic devices.	en_US
dc.title	Kajian berangka dan eksperimen bagi susun atur pakej pembawa plastik cip bertimbal (PLCC) yang dipasang sebaris secara mengufuk	en_US
dc.type	Thesis	en_US

Files

License bundle

Now showing 1 - 1 of 1

Name:: license.txt
Size:: 1.71 KB
Format:: Item-specific license agreed upon to submission
Description:

Collections

Pusat Pengajian Kejuruteraan Mekanikal - Tesis