Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
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Date
2009-11
Authors
Binh, Duong Ngoc
Journal Title
Journal ISSN
Volume Title
Publisher
Universiti Sains Malaysia
Abstract
Properties of lead free solder alloys (Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-
0.5Cu) on Au-Ni surface finished copper and copper substrates were investigated.
Results obtained showed good wetting of all three solder alloys on Au-Ni surface
finished substrate at appropriate temperatures. Contact angle measurement and
wetting force results reaffirmed that good wetting of solder alloys on substrate was
achieved. Microstructural analysis of the interface between solder alloys and Au-Ni
surface finished copper substrate revealed that the Au layer on the substrate had
dissolved completely into solder alloys after 20 seconds.
Description
Keywords
Interfacial Reactions And Electromigration In Lead-Free Solder Joints , Copper And Au-Ni Surface Finished Copper Substrates