Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates

Simple item page
dc.contributor.authorBinh, Duong Ngoc
dc.date.accessioned2018-08-17T02:29:27Z
dc.date.available2018-08-17T02:29:27Z
dc.date.issued2009-11
dc.description.abstractProperties of lead free solder alloys (Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag- 0.5Cu) on Au-Ni surface finished copper and copper substrates were investigated. Results obtained showed good wetting of all three solder alloys on Au-Ni surface finished substrate at appropriate temperatures. Contact angle measurement and wetting force results reaffirmed that good wetting of solder alloys on substrate was achieved. Microstructural analysis of the interface between solder alloys and Au-Ni surface finished copper substrate revealed that the Au layer on the substrate had dissolved completely into solder alloys after 20 seconds.en_US
dc.identifier.urihttp://hdl.handle.net/123456789/6346
dc.language.isoenen_US
dc.publisherUniversiti Sains Malaysiaen_US
dc.subjectInterfacial Reactions And Electromigration In Lead-Free Solder Jointsen_US
dc.subjectCopper And Au-Ni Surface Finished Copper Substratesen_US
dc.titleInterfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substratesen_US
dc.typeThesisen_US
Files
License bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description:
Download
Collections
Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral - Tesis