Thermal Performance Of Multi Piezoelectric Fan For Electronic Cooling Application Using 3-D Dynamic Mesh
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Date
2012-07
Authors
Abdullah @ Harun, Muhammad Khalil
Journal Title
Journal ISSN
Volume Title
Publisher
Universiti Sains Malaysia
Abstract
Piezoelectric fan (hereafter name as piezofan) can be manipulated to generate
airflow for cooling microelectronic devices. Its outstanding features include noise-
free operation, low power consumption and suitability for confined spaces. The
main aim of the present study was to investigate the performance of an oscillating
piezofan through the use of numerical modeling. The commercial CFD software
Fluent 6.3.2TM was used to solve the Reynolds Averaged Navier Stokes (RANS)
equations with the consideration of shear stress transport (SST) k- model. The
harmonic motion of the first mode in the deforming beam (piezofan) was developed
using C language, and was set under dynamic mesh option with the help of a user
defined function (UDF). A hybrid mesh was employed, with tetrahedral mesh used
around the piezofan deflection region in order to avoid negative cell volumes, and a
structured, prism mesh in the remaining envelop. The spring-based smoothing and
remeshing methods were employed to allow for oscillation of the piezofan
boundaries. The results revealed good agreement with the limited particle image
velocimetry (PIV) measurements available. This successful approach was then
employed in the study of flow field and heat transfer for both single-fan and multi-
fan oscillation over flat plate with consideration of wall effect i.e. y+ effect (y+ 1) at
a fixed tip gap of (the ratio of gap height to fin height). Study carried on the effect
of orientation angle ( ) showed that the multi-fan and normal orientation had
significant influence on the performance of heat transfer. A parametric study was
carried out in order to maximize the heat removal ability by considering parameters
such as orientation angle, and tip gap spacing ( ) in several configurations of heat
sink, using the popular Design of Experiments (DOE) approach.
Description
Keywords
Thermal performance of multi piezoelectric fan , for electronic cooling application