Thermal Performance Of Multi Piezoelectric Fan For Electronic Cooling Application Using 3-D Dynamic Mesh
| dc.contributor.author | Abdullah @ Harun, Muhammad Khalil | |
| dc.date.accessioned | 2019-06-25T07:00:40Z | |
| dc.date.available | 2019-06-25T07:00:40Z | |
| dc.date.issued | 2012-07 | |
| dc.description.abstract | Piezoelectric fan (hereafter name as piezofan) can be manipulated to generate airflow for cooling microelectronic devices. Its outstanding features include noise- free operation, low power consumption and suitability for confined spaces. The main aim of the present study was to investigate the performance of an oscillating piezofan through the use of numerical modeling. The commercial CFD software Fluent 6.3.2TM was used to solve the Reynolds Averaged Navier Stokes (RANS) equations with the consideration of shear stress transport (SST) k- model. The harmonic motion of the first mode in the deforming beam (piezofan) was developed using C language, and was set under dynamic mesh option with the help of a user defined function (UDF). A hybrid mesh was employed, with tetrahedral mesh used around the piezofan deflection region in order to avoid negative cell volumes, and a structured, prism mesh in the remaining envelop. The spring-based smoothing and remeshing methods were employed to allow for oscillation of the piezofan boundaries. The results revealed good agreement with the limited particle image velocimetry (PIV) measurements available. This successful approach was then employed in the study of flow field and heat transfer for both single-fan and multi- fan oscillation over flat plate with consideration of wall effect i.e. y+ effect (y+ 1) at a fixed tip gap of (the ratio of gap height to fin height). Study carried on the effect of orientation angle ( ) showed that the multi-fan and normal orientation had significant influence on the performance of heat transfer. A parametric study was carried out in order to maximize the heat removal ability by considering parameters such as orientation angle, and tip gap spacing ( ) in several configurations of heat sink, using the popular Design of Experiments (DOE) approach. | en_US |
| dc.identifier.uri | http://hdl.handle.net/123456789/8374 | |
| dc.language.iso | en | en_US |
| dc.publisher | Universiti Sains Malaysia | en_US |
| dc.subject | Thermal performance of multi piezoelectric fan | en_US |
| dc.subject | for electronic cooling application | en_US |
| dc.title | Thermal Performance Of Multi Piezoelectric Fan For Electronic Cooling Application Using 3-D Dynamic Mesh | en_US |
| dc.type | Thesis | en_US |
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