Publication: Modeling and simulation of thermal microactuator
Date
2009-04-01
Authors
Ang, Beng Seng
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Abstract
This thesis focuses on the modeling and simulation of a thermal bimorph
microactuator. It involves the modeling of electrothermal, mechanical, electrical and
geometrical characteristics of a thermal bimorph microactuator. Upon studying the
principles of a thermal microactuator, the analytical modeling and simulation is achieved
through CAD software, Coventorware®. For most materials, when they are heated, it
causes an increase in size; and a decrease in size occurs with decreasing temperature. The
amount of expansion is small when compared to the overall size of the device undergoing
the expansion. Therefore, actuation by thermal expansion must be coupled with a way to
amplify the motion or displacement. The best way to amplify the thermal expansion
motion is by varying the length of the arm rather than changing the input voltage. For the
same material properties of the thermal bimorph microactuator, changing the input
voltage consume more electrical power than the one that changes with the length.
Normally, the temperature in the thermal bimorph microactuator is only being changed
when the applied voltage varies. The displacement of the thermal bimorph microactuator
is not affected by the temperature change. The maximum temperature of the thermal
bimorph microactuator appears at the middle of the hot arm. The parameters that
influence the performance of the thermal bimorph microactuator are also discussed.